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2ch high side switch ics 0.5a current limit high side switch ics bd2046afj bd2056afj general description bd2046afj and bd2056afj are dual channel high side switch ics with an over current protection for universal serial bus (usb) power supply line. the i cs switch unit has two channels of n - channel power mosfe t . over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. features ? dual n - mos h igh s ide s witch ? control input logic ? active - low: bd204 6afj ? active - high : bd205 6afj ? soft start circuit ? over current detection ? thermal s hutdown ? under v oltage l ockout ? open d rain error fl ag o utput ? reverse -current p rotection when switch off ? flag output delay applications usb h ub in consumer a ppliances, note pc, pc p eripheral e quipment, and so forth key specifications ? i nput v oltage r ange: 2.7v to 5.5v ? on -r esistance: 100m (typ) ? continu ous current l oad: 0.25 a ? over - current t hreshold: 0.3 a (m in ) , 0.9 a (m ax ) ? s tandby current: 0.01 a ( typ ) ? output rise time: 1.8ms (typ) ? operating temperature range : -40 c to +85 c package w(typ) d(typ) h(max) typical applicat ion circuit lineup over - current t hreshold control input logic package orderable part number min typ max 0.3 a 0.5a 0.9a low sop - j8 reel of 2 5 00 bd2046afj -e2 0.3 a 0.5a 0.9a high sop - j8 reel of 2 5 00 bd2056afj -e2 sop - j8 4.90mm x 6.00mm x 1.65mm gnd in /en1 (en1) /oc1 out1 out2 /oc2 5v(typ) c l data /en2 (en2) c in data c l product structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays 1/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights re served. tsz22111 ? 14 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 datashee t downloaded from: http:///
bd2046afj bd2056afj data s heet gate logic1 ocd1 charge pump1 tsd1 uvlo charge pump2 ocd2 gate logic2 tsd2 /en1 en1 in /en2 en2 gnd /oc1 out1 out2 /oc2 delay delay gnd in v cc /oc2 out1 /oc1 /en1 out2 /en2 bd20 46afj top view gnd in /oc2 out1 /oc1 en1 out2 en2 bd2056afj top view block d iagram pin configurations pin description pin no. symbol i / o pin f unction 1 gnd i ground . 2 in i power supply input. input terminal to the switch and power supply input terminal of the internal circuit. 3, 4 en, /en i enable input. /en: switch on at l ow level. (bd2046afj) en: switch on at h igh level. (bd2056afj) high level input > 2.0v, l ow level input < 0.8v. 5, 8 /oc o error flag output . low at over current, thermal shutdown . open drain output. 6, 7 out o switch o utput. 2/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet absolute maximum ratings (ta=25 c) parameter symbol rating unit supply v oltage v in - 0.3 to + 6.0 v enable v oltage v en , v /en - 0.3 to + 6.0 v /oc v oltage v /oc - 0.3 to + 6.0 v /oc c urrent i /oc 10 ma out v oltage v out - 0.3 to + 6.0 v storage t emperature t stg - 55 to + 150 c power d issipation pd 0.67 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass - epoxy pcb. derating : 5.4mw/ o c above ta=25 o c caution: operating the ic over the absolute maximum ratings may damage the i c. the damage can either be a short circuit between pins or an open cir cuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommen ded operating conditions parameter symbol rating unit min typ max operating v oltage v in 2.7 - 5.5 v operating t emperature t opr - 40 - + 85 c continuous o utput current i lo 0 - 250 ma electrical c haracteristics bd2046afj (unless otherwise specified , v in = 5.0v, ta = 25 c) parameter symbol limit unit condition s min typ max operating current i dd - 110 140 a v /en = 0v, out = open standby c urrent i stb - 0.01 1 a v /en = 5v, out = open /en i nput v oltage v /enh 2.0 - - v high i nput v /enl - - 0.8 v low i nput - - 0.4 v low i nput 2.7v v in 4.5v /en i nput c urrent i /en - 1.0 + 0.01 + 1.0 a v /en = 0v or v /en = 5v /oc o utput low v oltage v /oc - - 0.5 v i /oc = 5ma /oc o utput l eak c urrent i l/oc - 0.01 1 a v /oc = 5v /oc delay time t /oc - 2.5 8 ms on -r esistance r on - 100 130 m i out = 250ma over - current threshold i th 0.3 0.5 0.9 a short circuit output curren t i sc 0.3 0.5 0.7 a v in = 5v, v out = 0v, c l = 100 f (rms) output r ise t ime t on1 - 1.8 10 ms r l = 20 , c l = open output t urn o n t ime t on2 - 2.1 20 ms output f all t ime t off1 - 1 20 s output t urn o ff t ime t off2 - 3 40 s uvlo t hreshold v tuvh 2.1 2. 3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in 3/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet electrical c haracteristics - c ontinued bd2056afj ( u nless otherwise specified , v in = 5.0v, ta = 25 c) parameter symbol limit unit condition s min typ max operating current i dd - 110 140 a v en = 5v , out = open standby c urrent i stb - 0.01 1 a v en = 0v , out = open /en i nput v oltage v enh 2.0 - - v high i nput v enl - - 0.8 v low i nput - - 0.4 v low i nput 2.7v v in 4.5v /en i nput c urrent i en - 1.0 + 0.01 + 1.0 a v en = 0v or v en = 5v /oc o utput low v oltage v /oc - - 0.5 v i /oc = 5ma /oc o utput l eak c urrent i l/oc - 0.01 1 a v /oc = 5v /oc delay time t /oc - 2.5 8 ms on -r esistance r on - 100 130 m i out = 250ma over - current threshold i th 0.3 0.5 0.9 a short circuit output c urrent i sc 0.3 0.5 0.7 a v in = 5v , v out = 0v, c l = 100 f (rms) output r ise t ime t on1 - 1.8 10 ms r l = 20 , c l = open output t urn o n t ime t on2 - 2.1 20 ms output f all t ime t off1 - 1 20 s output t urn o ff t ime t off2 - 3 40 s uvlo t hreshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in 4/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet gnd in en1 en2 /oc1 out1 out2 /oc2 v dd v en a 1f v en measurement circuit gnd in en1 en2 /oc1 out1 out2 /oc2 v dd v en 1f v en r l c l r l c l a. operating c urrent b. en , / en input voltage, o utput rise / fall time gnd in en1 en2 /oc1 out1 out2 /oc2 v dd v en 1f v en i out 10k 10k i out gnd in en1 en2 /oc1 out1 out2 /oc2 v dd v en 1f v en i out i out v dd c. on - resistance, o ver current detection d. /oc o utput low v oltage figure 1. measurement circuit timing diagram t on2 v /enl t on1 10% 90% v /enh 90% 10% t off1 v out v /en t off2 t on2 v enh t on1 10% 90% v enl 90% 10% t off1 v out v en t off2 figure 2. timing diagram ( bd2046afj) figure 3. timing diagram ( bd2056afj) 5/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical p erformance curves figure 6. standby current vs supply voltage (en, /en disable) 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] operating current : i stb [ua] ta=25 c 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[ ] operating current : i dd [ua] v in =5.0v figure 5. operating current vs ambient temperature (en, /en enable) figure 4. operating current vs supply voltage (en, /en enable) 0 20 40 60 80 100 120 140 2 3 4 5 6 supply voltage : v in [v] ta=25 c figure 7. standby current vs ambient temperature (en, /en disable) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] operating current : i stb [ua] v in =5.0v ambient temperature : ta [ c] ambient temperature : ta [ c] supply voltage : v in [v] supply voltage : v in [v] operating current : i dd [a] operating current : i dd [a] standby current : i stb [a] standby current : i stb [a] 6/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical performance curves - c ontinued 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en , v /en [v] 0 low to high high to low ta=25 c figure 8. en, /en i nput v oltage vs supply voltage 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] v in =5.0v high to low low to high figure 9. en, /en i nput v oltage vs ambient temperature 0.0 0.1 0.2 0.3 0.4 0.5 2 3 4 5 6 supply voltage : v dd [v] /oc output low voltage : v /oc [v] ta=25 c figure 1 0. /oc o utput low v oltage vs supply voltage 0.0 0.1 0.2 0.3 0.4 0.5 -50 0 50 100 ambient temperature : ta[ ] /oc output low voltage : v /oc [v] v in =5.0v figure 1 1. /oc o utput low v oltage vs ambient temperature ambient temperature : ta [ c] ambient temperature : ta [ c] supply voltage : v in [v] supply voltage : v in [v] enable input voltage : v en, v /en [v] enable input voltage : v en, v /en [v] /oc outpu t low voltage : v /oc [v] /oc output low voltage : v /oc [v] 7/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical performance curves - c ontinued 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] on resistance : r on [m] v in =5.0v figure 1 3. on -r esistance vs ambient temperature figure 1 2. on -r esistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 supply voltage : v dd [v] on resistance : r on[ m] ta=25 c ambient temperature : ta [ c] supply voltage : v in [v] on - resistance : r on [ m ] on - resistance : r on [ m ] figure 1 5. over - current threshold vs ambient tem perature v in =5.0v 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 over - current threshold : i th [a] ambient temperature : ta [ c] figur e 1 4. over - current threshold vs supply voltage ta=25 c 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 over - current threshold : i th [a] supply voltage : v in [v] 8/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical performance curves - c ontinued 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] ta=25 c figure 1 6. short circuit output current vs supply voltage 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] short circuit current : i sc [a] v in =5.0v figure 1 7. short circuit output current vs ambient temperature ambient temperature : ta[ c] supply voltage : v in [v] short circuit output current : i sc [a] short circuit output current : i sc [a] figure 1 8. output r ise t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] rise time : t on1 [ms] ta=25 c supply voltage : v in [v] output rise time : t on1 [ ms ] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] rise time : t on1 [ms] v in =5.0v figure 19. output r ise t ime vs ambient te mperature ambient temperature : ta [ c] output rise time : t on1 [ ms ] 9/ 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical performance curves - c ontinued 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] fall time : t off1 [us] ta=25 c figure 2 2. output f all t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [us] v in =5.0v figure 2 3. output f all t ime vs ambient temperature ambient temperature : ta [ c] supply voltage : v in [v] output fall time : t off1 [ s ] output fall time : t off1 [ s ] figure 20. output t urn on t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] turn on time :t on2 [ms] supply voltage : v in [v] output turn on time : t on2 [ ms ] ta=25 c figure 21. output t urn on t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn on time : t on2 [ms] v in =5.0v ambient temperature : ta [ c] output turn on time : t on2 [ ms ] 10 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical p erformance curves - c ontinued figure 2 4. output t urn off t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] turn off time : t off2 [us] ta=25 c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [us] v in =5.0v figure 25 . output t urn off t ime vs ambient temperature ambient temperature : ta [ c] supply voltage : v in [v] output turn off time : t off2 [ s ] output turn off time : t off2 [ s ] figure 2 7. /oc delay time vs ambient tem perature v in =5.0v 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 /oc delay time: t /oc [ ms ] ambient temperature : ta [ c] figure 26. /oc delay time vs supply voltage ta=25 c 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 /oc delay time: t /oc [ ms ] supply voltage : v in [v] 11 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical performance curves - c ontinued 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold voltage : v u vl oh , v u vl ol [v] v tuvh v tuvl figure 2 8. uvlo threshold v oltage vs ambient temperature 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 figure 2 9. uvlo hysteresis voltage vs ambient temperature ambient temperature : ta [c] ambient temperature : ta [ c] uvlo threshold : v tuvh , v tuvl [v] uvlo hysteresis voltage : v hys [v] 12 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical wave forms time(1ms/div.) figure 30. output rise characteristic (bd2056afj) v /oc (5v/div.) v en (5v/div.) v in =5v r l =10 c l =100 f v out (5v/div.) i out (0.5a/div.) time(20ms/div.) figure 33. over current r esponse r amp ed l oad (bd2056afj) v /oc (5v/div.) v out (5v/div.) i out ( 0.5a/div.) v in =5v time(1ms/div.) figure 31. output fall characteristic (bd2056afj) v en (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v r l =10 c l =100 f vin=5v rl=20 time(500 s/div.) figure 32. inrush current r esponse (bd2056afj) v en (5v/div.) v /oc (5v/div.) i out (0.2a/div.) c l =47 f c l =100 f c l =147 f c l =200 f v in =5v r l =20 13 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical wave forms - c ontinued time ( 2ms/div.) figure 3 5. over current r esponse enable to short circuit (bd2056afj) v in =5v c l =100 f v en (5v/div.) v /oc (5v/div.) v o ut (5v/div.) i out (0.5a/div.) v in =5v v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) time(2ms/div.) figure 3 4. over current r esponse r amp ed l oad (bd2056afj) time ( 1ms/div.) figure 3 6. over current r esponse 1 short at enable (bd2056afj) i out (1.0 a/div.) v /oc (5v/div.) v out (5v/div.) v in =5v c l =100 f time ( 500ms/div.) figure 3 7. over current r esponse 1 short at enable (bd2056afj) v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) v in =5v c l =100 f thermal shutdown 14 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical wave forms - c ontinued time ( 1s/div.) figure 3 8. uvlo r esponse wh en increasing v in (bd2056afj) v in (5v/div.) v out (5v/div.) i out (0.5a/div.) v /oc (5v/div.) r l =20 c l =100 f regarding the output rise/fall and over current detection characteristics of bd2046afj , refer to the characteristic of bd2056afj. v in (5v/div.) v out (5v/div.) i out (0.5a/div.) v /oc (5v/div.) r l =20 c l =100 f time ( 1s/div.) figure 3 9. uvlo r esponse when decreasing v in (bd2056afj) 15 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet typical a pplication c ircuit on/off oc oc on/off gnd in /en1 (en1) /oc1 out1 out2 /oc2 10k to 100k 5v(typ) out in vbus d+ d- gnd data regulator usb controller bd2046afj/56afj c l data /en2 (en2) 10k to 1 00k c in data c l application information when excessive current flows due to output short - circuit or so, ringing occurs because of inductance between power source line and ic. this may cause bad effects on ic operations. in order to avoid this case, connect a bypass capacitor across in ter minal and gnd terminal of ic. 1f or higher is recommended. pull up /oc output by a resistance value of 10k to 100k. set up values for c l which satisfies the application. this application circuit does not guarantee its operation. when using the circuit w ith changes to the external circuit constants, make sure to leave an adequate m argin for external components including ac/dc characteristics as well as dispersion of the ic. functional d escription 1. switch operation in terminal and out terminal are connected to the drain and the source of swi tch mosfet respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on from en/en control input, the in terminal and out terminal are connected by a 10 0m switch. in on status, the switch is bidirectional. therefore, when t he potential of out terminal is higher than that of the in terminal, current flows from out terminal to in terminal. since a parasitic diode between the drain and the source of switch mosf et is not present during off status, it is possible to prevent current from flowing reversely from out to in. 2. thermal s hutdown c ircuit ( tsd) thermal shutdown circuit have dual thermal shutdown t hreshold . t hermal shutdown works when a high junction tem perature due to an over current occurs, then the switch turns off and outputs an error flag (/oc) . thermal shut down action has hysteresis. when the junction temperature goes down, the switch automatically turns on and resets the error flag. unless the cause of increase of the chips temper ature is removed or the output of power switch is turned off, this operation repeats. the thermal shutdown circuit works when the switch of either out1 or out2 is on (en, /en signal is active). 16 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet 3. over c urrent d etection ( o cd) the over current detection circuit limits current (i sc ) and outputs an error flag ( / oc) when current flowing in each switch mosfet exceeds a specified value. there are three types of response against over current. the over current d etection circuit wor ks when the switch is on ( en, /en signal is active). (1) when the switch is turned on while the output is in short - circuit status, the switch goes into current limit status immediately. (2) when the output short - circuits or high - current load is connected while th e switch is on, very large current flows until the over current limit circuit reacts. when the current detection an d limit circuit works, current limitation is carried out. (3) when the output current increases gradually, current limitation does not w ork u ntil the output current exceeds the over current detection value. when it exceeds the detection value, curre nt limitation is carried out. 4. under v oltage l ockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v (typ). if v in drops below 2.2v (typ) while the switch is still on, then uvlo shuts off the switch. uvlo has a hysteresis of 100mv (typ) . note: under voltage lockout circuit works when the switch of either out1 or out2 is on (en , /en signal is active). 5. error flag (/oc ) output error flag output is n- mos open drain output. at over current and/or thermal shutdown detection, the output level is low. o ver current detection has a delay filter . this delay filter prevents current detection flags from being sent during instan taneous events such as surge current at switch on or hot plug. if fault flag output is unused, /oc pin should be connected to open or ground line. v /en v out i out v /oc output s hort c ircuit thermal s hutdown /oc d elay time figure 40. o ver current detection, thermal shutdown timing (bd2046 afj) v en v out i out v /oc output s hort c ircuit thermal s hutdown /oc d elay time figure 41. o ver current detection, thermal shutdown timing (bd2056 afj) 17 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet power d issipation (sop- j8) figure 42. power d issipation c urve (pd- ta curve) i/o e quivalen ce circuit symbol pin no e quivalen ce circuit en1(/en1) en2(/en2) 3, 4 /en1(en1) /en2(en2) /oc1 /oc2 5, 8 /oc1 /oc2 out1 out2 6, 7 out1 out2 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 a mbient tempera ture : ta [ ] power dissipation : pd [mw] power dissipation: p d [ mw ] ambient temperature: ta[c] 70mm x 70mm x 1.6mm glass epoxy board 18 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damag e the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pins . 2. power s upply l ines design the pcb layout pattern to provide low impedance su pply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affect ing the analog block . furthermore, connect a capacitor to ground at all power supply pins . con sider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, ev en during transient condition. 4. g round w iring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to av oid fluctuations in the small - signal ground caused by larg e currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possibl e to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of t he pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic ca n be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. in r ush current when power is first supplied to the ic, it is possible that the int ernal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, p ower wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely af ter each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspec tion process. to prevent damage from static discharge, ground the ic during assem bly and use similar precautions during transport and storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few . 19 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. t he gate has extremely high i mpedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused inpu t pins should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with t he n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junc tion operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, o perational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 43. example of monolithic ic s tructure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and oth ers. 14. thermal s hutdown circuit(tsd) this ic h as a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operat ion should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operat ion. note that the tsd circuit operates in a situation that exceeds the absol ute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account the p ower dissipation (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 20 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet ordering information b d 2 0 4 6 a f j - e 2 part n umber package fj: sop - j8 packaging and forming specification e2: embossed tape and reel b d 2 0 5 6 a f j - e 2 part n umber package fj: sop - j8 packaging and forming specification e2: embossed tape and reel marking diagram part number part number marking bd2046afj d046a bd2056afj d056 a sop - j8 ( top view) part number marking lot number 1pin mark 21 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet physical d imension , tape and reel information package name sop -j8 22 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
bd2046afj bd2056afj data s heet revision history date revision changes 11 . mar .201 3 001 new release 21 .aug .2014 002 applied the rohm standard style . add typical performance curves for over - current threshold and /oc delay tim e. 23 / 23 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300140 -1-2 21.aug.2014 rev.002 downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or l iable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and c onfirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cl eaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, exp enses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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